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Universal automatic silicone epoxy resin UV glue dispensing machine
Universal automatic silicone epoxy resin UV glue dispensing machine
  • Universal automatic silicone epoxy resin UV glue dispensing machine

  • item No : WPM-221 WPM-331 WPM-441 WPM-551 WPM-4331 WPM-5331
  • Universal automatic silicone / epoxy resin / UV glue dispensing machine, Epoxy Resin Dispensing Machine, Glue Dispensing Automatic, Silicone Dispensing Machine
    1. Can replace manual operation with high precision programming of dots, stripes, arcs, and patterns on different planes or curved surfaces.
    2. Suitable for positioning of different jobs.
    3. It supports graphics importing from computers, PLT files, TCF files, and G code files.
    4. Suitable for glue: Anaerobic, Coatings, Cyanoacrylates, White Glues, Epoxy Resin, Greases, Sealants, Silicones, Solder/Braze Pastes, Thermal Grease, Conductive Adhesive, Red Gum, UV Glue, AB Glue, Polyurethane Resin Adhesive, etc.

    This equipment is suitable for high efficiency, high running precision, and the production process of dispensing. Generally suitable for products with sensors, relays, power adapters, electronic toys, sounders, electronic components, household

    appliances, electric vehicle controllers, computer digital products, crafts, mobile phone boards, coil products, button products, battery boxes, speakers Dot glue bonding; speaker packaging and dispensing, optical semiconductor, mobile phone battery, laptop battery packaging, PCB board bonding, COB, IC, PDA, LCD sealing, IC packaging, IC bonding, chassis bonding, Optical device processing, hardware parts package coating, quantitative liquid filling, chip bonding, automotive mechanical parts coating, mechanical seals, etc.

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Detailed description
Universal automatic silicone / epoxy resin / UV glue dispensing machine
Epoxy Resin Dispensing Machine, Glue Dispensing Automatic, Silicone Dispensing

一、Parameter:

Model

WPM-221

WPM-331

WPM-441

WPM-551

WPM-4331

WPM-5331

Number of controlled axes

Three-axis

Four-axis

Effective travel

X axis

200mm

300mm

400mm

500mm

400mm

500mm

Y1 axis

200mm

300mm

400mm

500mm

300mm

300mm

Y2 axis

300mm

300mm

Z axis

50mm

100mm

100mm

100mm

100mm

100mm

Transmission mode

Double-track timing belt

Power source

Stepper motor

Top speed

500mm/sec

Repeat accuracy

±0.05mm

Maximum load

X/Y/Z 5kg/5kg/2kg

Control System

Hand-held three-axis control system

File storage space

400 sets of processing files, up to 9999 points in a single file.

Power

AC110-250V 50-60HZ 350W

Size

L

475mm

520mm

620mm

720mm

620mm

720mm

W

410mm

585mm

685mm

785mm

585mm

585mm

H

522.5mm

596.5mm

596.5mm

596.5mm

596.5mm

596.5mm

Weight

35kg

44kg

59kg

65kg

63kg

62kg

二、Main accessories

1

motor

Stepper motor

2

Drive

YAKO (China)

3

Linear Guides

(Taiwan) X / Y axis dual rail, Z-axis single rail

4

Three-axis control system

 (China)

5

Power supply

Ming Wei (China)

1. Can replace manual operation with high precision programming of dots, stripes, arcs, and patterns on different planes or curved surfaces.
2. Suitable for positioning of different jobs.
3. It supports graphics importing from computers, PLT files, TCF files, and G code files.
4. Suitable for glue: Anaerobic, Coatings, Cyanoacrylates, White Glues, Epoxy Resin, Greases, Sealants, Silicones, Solder/Braze Pastes, Thermal Grease, Conductive Adhesive, Red Gum, UV Glue, AB Glue, Polyurethane Resin Adhesive, etc.

This equipment is suitable for high efficiency, high running precision, and the production process of dispensing. Generally suitable for products with sensors, relays, power adapters, electronic toys, sounders, electronic components, household

appliances, electric vehicle controllers, computer digital products, crafts, mobile phone boards, coil products, button products, battery boxes, speakers Dot glue bonding; speaker packaging and dispensing, optical semiconductor, mobile phone battery, laptop battery packaging, PCB board bonding, COB, IC, PDA, LCD sealing, IC packaging, IC bonding, chassis bonding, Optical device processing, hardware parts package coating, quantitative liquid filling, chip bonding, automotive mechanical parts coating, mechanical seals, etc.
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