5300 Auto Optical Alignment System Mobile BGA Rework Station 2 Zones 2500W

Price in reward points: 5313
  • Brand: unbranded1
  • Product Code: ly725500503
  • Availability: In Stock
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5300 Auto Optical Alignment System Mobile BGA Rework Station 2 Zones 2500W



Mobile rework video:https://youtu.be/cO5RII03_bU


Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc.

The main user is repairing shops and factory to provide the after-sales service and rework.

How to separate BGA chip from motherboard? 
How to replace a new BGA chip?

Repair steps:
1)      Separate the BGA chip from mother board –we called desoldering
2)      Clean Pad
3)      Reballing  or replace a new BGA chip directly
4)      Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5)      replace a new BGA chip - we called Soldering


Power supply

AC 220V±10% 50/60Hz

3

Total power

Max 2500W

4

Heater power

Upper temp.zone 1200W,Down temp.zone 1200W

5

Electrical material

Driving motor+ smart temp.controller+color touch screen

6

Temperature controlling

(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1

7

Locating way

V shape slot,PCB support jigs can adjust

8

PCB size

Max 140×160mm Min 5×5 mm

9

Applicable chips

Max 80×80mm Min 1×1 mm

10

Overall dimension

L450×W470×H670mm

11

Temperature Interface

1 pcs

12

Weight of machine

40KG

13

Color

Blue+White Mini BGA rework station

Nozzles : 3 top,1 bottom(Top 18*18mm,12*12mm,14*20mm,Bottom 25*25mm)

CertificationCE
is_customizedYes
Model Number5300
OriginMainland China

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